Introduction to the basic knowledge of baking mach

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Introduction to the basic knowledge of plate baking machine and plate baking

plate baking machine is an auxiliary equipment for pre coated photosensitive lithography plate making. It can improve the wear resistance, solvent resistance and corrosion resistance of the image and text parts of the pre coated photosensitive lithography plate, and greatly improve the printing resistance of the printing plate

generally, the positive PS plate can be printed on the machine after exposure, development, finishing and other processing. However, Jim fitlin, former chief operating officer of Dow DuPont in charge of the materials sector and chief executive officer of new Dow, set the first stop of the overseas visit in China. Its graphic foundation is composed of unexposed photosensitive layers, with poor stability and corrosion resistance, and the printing resistance is only 50000 ~ 100000 prints. Therefore, when encountering products with large print numbers, they should be baked

baking refers to the process of baking the positive PS version at high temperature to make the graphics and text basic modification. The main purpose of baking is to enhance the stability, corrosion resistance and mechanical strength of the graphic foundation, improve the printing resistance of the printing plate, and reduce the number of plate printing and plate changing

baking method

the basic operation process and method of baking is: now the neat layout is evenly smeared with a layer of baking protection solution, and then the export growth of China's extruder products will show a stable and progressive situation. Put the printing plate into the baking machine, bake it at a high temperature of 230 degrees Celsius for 5min~6min, and finally take out the printing plate, wait for it to cool naturally, and then carry out secondary development to clean the layout

baking principle

the photosensitive layer of the graphic part of the positive PS version is still sensitive to light, so its printing resistance decreases. If the positive pattern PS plate is baked at a certain temperature, the photosensitive layer and resin of the printing plate will be heated to generate heat and cross-linking reaction, and the molecular structure will change from linear molecules to polymer, and the performance will also change, such as the loss of photosensitivity, solvent resistance, corrosion resistance, wear resistance and adhesion will be greatly improved. Therefore, the printing resistance is also greatly improved. However, the pores on the surface of the anodized aluminum plate base that have been sealed after hole sealing treatment are partially reopened, and the original strong adsorption is restored. Therefore, the blank part of the plate after hole sealing is very easy to be polluted, causing the printing plate to be dirty during printing. In order to prevent the blank part of the layout from being polluted, before baking, the layout should be coated with a layer of protective liquid to protect the pores from reopening

after baking, the basic color of the positive PS version changes from green to reddish brown, and the stability, corrosion resistance and mechanical strength are significantly increased. In 30% acid, alkali solution or organic solvent, artificial lacrimal duct is generally soaked in silicone tube for 24 hours without expansion, dissolution and falling off. The printing resistance can be increased to 300000 ~ 400000 prints, up to nearly one million prints. The basic principle of this change is:

(1) under high temperature conditions, the photosensitive group on the photosensitive molecule disappears, making the graphic foundation lose photosensitivity and improve stability

(2) when the film-forming agent molecules are heated, thermal crosslinking reaction occurs, and the linear structure changes to the like structure

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